| 发明名称 |
Method for tape automated bonding. |
| 摘要 |
<p>Solder tape automated bonding of leads to an integrated circuit chip is performed using a constant temperature, flat faced thermode and a clamping plate to keep the leads in contact with the integrated circuit chip.</p> |
| 申请公布号 |
EP0463788(A2) |
申请公布日期 |
1992.01.02 |
| 申请号 |
EP19910305524 |
申请日期 |
1991.06.19 |
| 申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY |
发明人 |
DAVISON, KERRY LEEDS |
| 分类号 |
H01L21/60;B23K20/02;H01L21/48;H01L21/603;H05K3/34 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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