| 摘要 |
The appts. to spread glued chips, for chipboard mfg., has a ball separator (8) between the material delivery (4) and spreader (5) stages. The ball separator (8) is a disc sieve assembly, with a number of discs (11) on powered shafts, at a gap from each other so that adjacent disc assemblies can intermesh with each other. The material is delivered (4) at the entry side of the separator (8), and a conveyor belt (129 below the discs (11) carries the material to the spreader (5), and a ball trap (9) is at the end of the separator (8). The spreader system (5) is below the ball separator (8). The gap between the discs (11) of the ball separator (8) is less than the dia. of the balls to be separated for rejection. The rotary speed of the sorting disc assembly (8) is structured according to the volume of material delivered (4) by the dosing conveyor (3). The discs (11) have a toothed structure (13) round their circumference, matching the dia. of the balls to be separated, to carry them through the ball separator (8) assembly and then, through their rotary speed, eject them to the ball trap (9) at the end. ADVANTAGE - The system separates out ball clumps of chips, without adverse effect on the chip spreading action.
|
