发明名称 |
Hollow chip package and method of manufacture. |
摘要 |
Semiconductor package and method in which a chip (14) is mounted in an opening (12) in a frame (11) with the back side of the chip facing outside the package, and a heatsink (21) is positioned in direct thermal contact with the back side of the chip. In one preferred method of manufacture, the chip is mounted in the frame and tested before the heatsink is attached. <IMAGE> |
申请公布号 |
EP0463758(A1) |
申请公布日期 |
1992.01.02 |
申请号 |
EP19910305206 |
申请日期 |
1991.06.10 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
HAMBURGEN, WILLIAM RIIS |
分类号 |
H01L23/36;H01L21/52;H01L23/057;H01L23/13;H01L23/367 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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