METHOD FOR EMI/RFI SHEILDING AN INFRARED ENERGY REFLOW SOLDERED DEVICE

摘要

An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).