| 摘要 |
There is provided a high-conductivity copper alloy with excellent workability and heat resistance, characterized by the alloy consists essentially of, by weight, at least one element selected from the group consisting of -10-100 ppm In (indium), 10-1000 ppm Ag (silver), -10-300 ppm Cd (cadmium), 10-50 ppm Sn (tin), -10-50 ppm Sb (antimony), 3-30 ppm Pb (lead), -3-30 ppm Bi (bismuth), 3-30 ppm Zr (zirconium), -3-50 ppm Ti (titanium) and 3-30 ppm Hf (hafnium), - and the balance copper. S (sulfur) and O (oxygen) as unavoidable impurities are controlled to amounts of less than 3 ppm S, and less than 5 ppm O, respectively. Other unavoidable impurities are controlled to less than 3 ppm in total amount. The alloy is very suitable for applications such as forming magnet wires and other very thin wires, lead wires for electronic components, lead members for tape automated bonding (TAB) and the like, and members for printed-circuit boards.
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