| 摘要 |
Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles so that each bonded particle is between and in contact with a pad and a lead. Preferably the particles are solid spheres 1.0 mils in diameter. The spheres may be applied by covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of vehicle and spheres.
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