| 摘要 |
An improved automated method for the manufacture of small implantable passive transponder devices is presented in which semiconductor wafer die are bonded to a conductively coated tape leadframe. This tape, with die attached, is injected molded to form a cap around the leads and the attached die, such that the exposed portion of the leads extend laterally from the cap. A ferrite core is attached to the base of the cap, and a fine coil wire, dispensed from a specially designed applicator, is automatically bonded to one of the leads protruding from the cap body. The wire is subsequently wound around the ferrite core and terminated by automatic attachment to another of the protruding leads. The assembled device is thereafter encapsulated within a small glass housing. |
