| 摘要 |
The present invention is a method of creating a ring surrounding a chip carrier having a lead frame premolded to a carrier body or housing. The ring is comprised of a first premolded section having a first predetermined shape and a second premolded section having a second predetermined shape. A non-conductive adhesive material is applied to a mating side of each of said sections. These first and second sections are combined to form the ring in which certain portions of the first section mate into the second section through matching holes in the metal lead frame of the chip carrier package. The resulting chip carrier ring is positioned in a short distance from the carrier body relative to the length of any of the four sides of the carrier body in order to gain mechanical strength provided by the plurality of leads, thus avoiding the substantial bending of individual leads.
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