发明名称 High density cabled midplanes and backplanes
摘要 A cabled midplane includes a first support plate along a plane between a first connector set and a second connector set that connect to line cards on either side of the cabled midplane. The first connector set and the second connector set include connector slices. A wiring sub-layer includes cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set. Additional wiring sub-layers are added, and a second support plate, parallel to the first support plate, is provided to encase and support the wiring sub-layers between the first support plate and the second support plate. Other apparatuses and methods are described.
申请公布号 US9413097(B2) 申请公布日期 2016.08.09
申请号 US201414578707 申请日期 2014.12.22
申请人 Intel Corporation 发明人 Tamarkin Vladimir;Genetti Wayne;Mease Keith;Wessel Mark
分类号 H01R13/502;H01R43/20 主分类号 H01R13/502
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. A cabled midplane comprising: a first support plate along a plane between a first connector set and a second connector set, the first connector set including a plurality of connectors to connect to respective line cards on a first side of the cabled midplane, the second connector set including a plurality of connectors to connect to respective line cards on a second side of the cabled midplane, connectors of the first connector set and the second connector set including a plurality of connector slices, the plurality of connector slices including at least a first connector slice that is a first distance along a first axis from the first support plate and a second connector slice that is a second distance, further than the first distance, along the first axis from the first support plate; a first wiring sub-layer including a first plurality of cable slices mounted on the first support plate, each cable slice of the first plurality of cable slices to provide a connection between the first connector slice of a connector of the first connector set to the first connector slice of a connector of the second connector set, such that the first wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; at least a second wiring sub-layer including a second plurality of cable slices, each cable slice of the second plurality of cable slices to provide a connection between the second connector slice of a connector of the first connector set to the second connector slice of a connector of the second connector set, such that the second wiring sub-layer connects each connector of the first connector set, through one cable slice, to a connector of the second connector set; and a second support plate, parallel to the first support plate, to encase the first wiring sub-layer and the second wiring sub-layer between the second support plate and the first support plate and to form a first wiring layer of the cabled midplane.
地址 Santa Clara CA US
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