| 摘要 |
PURPOSE:To improve the resistance to soldering heat and moisture after dipping in solder by compounding an alkyl-modified polyepoxy resin with a polyhydric phenol resin, a powdered silica, a carnauba wax, and a specific mixed wax. CONSTITUTION:An alkyl-modified hydroxybenzaldehyde having an alkyl group of formula I (wherein m>=1) is reacted with an alkyl-modified phenol having an alkyl group of formula II (wherein 10>=n>=1) to give a resin, of which phenolic hydroxyl groups are epoxidized to give an alkyl-modified polyepoxy resin. The resulting resin is compounded with a polyhydric phenol resin of formula III or IV (wherein n and m are each 0 or higher; and R is a group of formula I), 50-90wt.% powdered silica having a high purity and a mean particle diameter of 30mum or lower, 0.01-1wt.% carnauba wax, and 0.01-1wt.% mixed wax comprising a higher alcohol and a higher fatty acid ester. |
