发明名称 JIG FOR SEMICONDUCTOR DEVICE AND MANUFACTURE OF SEMICONDUCTOR DEVICE USING THE SAME
摘要 <p>PURPOSE:To regulate adhesive power and to hold the power constant to a chip by forming a flat ultraviolet ray curable adhesive film covering an uneven part on an ultraviolet transmission base having the uneven part on its surface. CONSTITUTION:An adhesive tape 10 is formed of an ultraviolet ray transmission board 8 having an uneven part on the surface and a flat surface ultraviolet ray curable adhesive film 9 covering the uneven part. If a wafer 13 is divided into chips, the wafer 13 is adhered on the film 9 of the tape 10, and divided into a plurality of chips. When the rear surface is emitted with an ultraviolet ray, an optical path from the front surface of the protrusion 12 to the wafer 13 is short, the optical path from the bottom of the recess 1 to the wafer 13 is long. Thus, a cured region and a noncured region are formed on the film 9, and the original adhesive power is held in a dispersive region on the film 9. Accordingly, the density and emitting time of the protrusions 12 can be regulated, predetermined adhesive power is can be held to simplify a peeling stop.</p>
申请公布号 JPH03297157(A) 申请公布日期 1991.12.27
申请号 JP19900099902 申请日期 1990.04.16
申请人 FUJITSU LTD;KIYUUSHIYUU FUJITSUU EREKUTORONIKUSU:KK 发明人 YOSHIMURA HIROSHI;ANDO CHITOSHI
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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