发明名称 PREPREG AND MULTI-LAYER BOARD PREPARED THEREFROM
摘要 PURPOSE:To prepare a prepreg which hardly allows void and resin flow to occur in press molding to prepare a multi-layer board by impregnating a nonwoven fabric contg. an arom. polyamide fiber with a B-stage epoxy resin compsn. which satisfies specific requirements. CONSTITUTION:A prepreg is prepd. by impregnating a nonwoven fabric contg. an arom. polyamide fiber with a B-stage epoxy resin compsn. which satisfies the requirements: 35wt.% <= resin pick up <= 80wt.%, 70sec <= gel time <=180sec, 2500<=wt. average mol.wt. (Mw)<=4000, 500 <= number-average mol.wt. (Mn) <= 800, and 3.0 <= dispersion (Mw/Mn) <= 7.0.
申请公布号 JPH03296535(A) 申请公布日期 1991.12.27
申请号 JP19900098671 申请日期 1990.04.13
申请人 TEIJIN LTD 发明人 NISHIMURA KUNIO;HIRAKAWA TADASHI
分类号 C08J5/24;B32B5/28;C08L63/00;H05K1/03;H05K3/46 主分类号 C08J5/24
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