| 摘要 |
<p>PURPOSE:To obtain a wiring board serviceable for long time even under a high temperature environment by installing an ion-radiation-based conductivity layer on the surface of an insulator substrate and a metal penetration layer in the substrate. CONSTITUTION:Copper is deposited on the surface of an insulator substrate 11 from a vaporization source 21. Mask 23 is applied to a copper deposited layer 15 where an ion beam 24 is irradiated. A conductivity layer 13 is formed on a macromolecular material of the insulator substrate 11 under the copper layer 15. Some ions are collided with copper atoms in the copper layer 15 and force the copper atoms into the lower part of the insulator substrate 11, thereby forming a metal penetration layer 14 laminated on the conductive layer 13. Then, the layer is submerged in an FeCl3 solution 30 where copper in a non-ion beam radiation section is eliminated so that a circuit pattern 12 responding to the mask window 22 may be obtained. This construction makes it possible to increase the conductivity of the whole circuit patterns 12 due to the high conductivity of the metal penetration layer and reduce ion radiation time to such a degree that a single radiation operation may be acceptable.</p> |
