| 摘要 |
<p>PURPOSE:To effectively utilize the area of a printed circuit board and to downsize a circuit by providing a land having a through hole or a viahole between a die pad for placing a bare chip IC and a wire bonding pad. CONSTITUTION:A land 6 has a through hole or a viahole for connecting an inner layer circuit to a wire bonding pad 3. A land 6 having the through hole or the viahole is provided between a die pad 2 for placing a bare chip IC and the pad 3 to effectively utilize the area of a ceramic multilayer printed circuit board 1. Thus, the board can be reduced in size.</p> |
