| 摘要 |
PURPOSE:To increase a support strength to inner lead parts and to prevent the breaking or deformation of the inner lead parts by a method wherein at least the inner lead parts of each lead plug formed in a film carrier are supported by the film carrier. CONSTITUTION:Device holes 2 for heat dissipation use are opened in a tape- shaped insulative film 1 at a constant pitch in the longitudinal direction of the film 1. A copper foil is adhered on the periphery of each device hole 2 with a bonding agent, this copper foil is etched and a plurality of lead wires 4 are formed in the direction to intersect orthogonally to each side of the film 2. Inner lead parts 4a of the wires 4 are constituted in such a way that the tips of the inner lead parts 4a are not made to project in the hole 2 and the whole lead wires 4 are directly supported by the film 1. The tips of the inner lead parts 4a are ready-positioned so as to coincide with the positions of electrodes, which are bonded on the film 1, of a semiconductor chip 5. Accordingly, the size of the hole 2 is smaller than that of the chip 5 which is bonded to a film carrier 9. |
