| 摘要 |
<p>PURPOSE:To enable a semiconductor substrate suction device to be rotated as it sucks a semiconductor substrate by a method wherein a semiconductor substrate sucking section provided with a suction hole is fitted to the tip of a rod in a rotatable manner. CONSTITUTION:A vane 8 is fitted to a rotary part 12 of a sucking part 5, and air is blown against the vane 8. Air required for rotating the vane 8 is supplied from a nozzle through which air is taken in from outside. Air rotating the vane 8 is forcibly exhausted outside through an exhaust pipe 10, and the rotation of the vane 8 is controlled by an exhaust switch 11 inserted at the intermediate point of the exhaust pipe 10. Photosensors are arranged on a part of a rod 3 in lines so as to automatically detect an orifra 7, whereby the orifra 7 is detected and automatically positioned even if a semiconductor substrate 4 is sucked by the suction part 5 off its center.</p> |
