Light-emitting diodes

摘要

A light-emitting diode includes a carrier including a metallic basic body having an outer face including a mounting face; and at least two light-emitting diode chips affixed to the carrier at least indirectly at the mounting face, wherein the at least two light-emitting diode chips are embedded in a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, and the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips.

主权项

1. A light-emitting device comprising:
a carrier comprising a metallic basic body having an outer face comprising a mounting face; and at least two light-emitting diode chips affixed to the carrier at the mounting face, wherein the at least two light-emitting diode chips are laterally surrounded by a reflective coating covering the mounting face and side faces of the at least two light-emitting diode chips such that the at least two light-emitting diode chips protrude with radiation exit surfaces out of the reflective coating, or that the reflective coating terminates flush with the radiation exit surfaces of the at least two light-emitting diode chips, the at least two light-emitting diode chips have radiation exit surfaces facing away from the carrier, the carrier comprises a further electrically insulating layer affixed to the metallic basic body on the side facing the light-emitting diode chips, the carrier comprises an electrically conductive layer affixed to the further electrically insulating layer on a side facing away from the metallic basic body, the electrically conductive layer comprises a first conductor track electrically connected to the at least two light-emitting diode chips and a further conductor track electrically connected to the metallic basic body, the light-emitting diode chips electrically connect in parallel with one another via the metallic basic body, the carrier comprises at least one opening, wherein the at least one opening completely passes through the further electrically insulating layer and the electrically conductive layer, and a side face of the further electrically insulating layer in the at least one opening and a side face of the electrically conductive layer in the at least one opening are covered by an electrically insulating material.