| 摘要 |
<p>PURPOSE:To enable a package size to be reduced and the package to be thin by forming through holes in an insulation substrate in island shape corresponding to a pad of a semiconductor element. CONSTITUTION:A polyimide substrate 21 where a lead 20 with an inner lead part 22 and an outer lead part 23 is formed in a specified pattern is fixed to a surface for forming a pad 12a of an IC chip 12 and through holes 24 are formed in island shape in the polyimide substrate 21 corresponding to the pad 12a of the IC chip 12, The polyimide substrate 21 consists of a continuous layer surrounding the through holes 24 and at the same time the inner lead parts 22 and the pads 12a are connected through the through holes 24 so that a surface of the IC chip 12 can be utilized effectively and the level differences between the pads 12a and the inner lead parts 22 can nearly be eliminated, thus eliminating the need for an extra region, etc., for preventing an edge of the IC chip 12 from contacting a wire 13 for achieving a reduced package size.</p> |
