SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND HEATING UNIT

摘要

The present invention is to shorten a temperature settling time in a processing path. A substrate processing apparatus comprises: a substrate holding unit for holding a plurality of substrates; an insulating unit installed on the lower side of the substrate holding unit; a processing room for containing the substrate holding unit and processing the plurality of substrates; a first heating unit installed around the processing room and heating the inside of the processing room on a side; a second heating unit installed between the substrate holding unit and the heating unit within the processing room. The second heating unit includes a substantially ring-shaped exothermic unit, and a loading unit extended from the heating unit downwards. The exothermic unit is contained in a ring-shaped area having a smaller diameter than the substrate.