| 摘要 |
PURPOSE:To eliminate an expensive facility and complicated forming steps, and to form bumps only on a semiconductor chip of satisfactory product by providing a resin film on a bonding pad, and holding conductive particles on the film. CONSTITUTION:A resin film 9 is provided on a bonding pad 2, conductive particles 10 are held on the film 9, and a wiring terminal 12 of a board is conducted to the pad 2 on a semiconductor device by the particles 10. That is, in order to hold the particles 10 on the film 9, it is performed by physical steps of forming the film 9 and then pressing the particles 10 on the film 9. After a wafer is divided into respective semiconductor chip 8, the bumps can be formed. Thus, the bumps can be formed only on the chip of satisfactory product, and an expensive manufacturing facility is not required. |
