发明名称 ELECTRONIC PARTS MOUNTING SUBSTRATE USING FILM
摘要 <p>PURPOSE:To make a power line to not produce a large impedance by dividing one lead having the largest width among others into two parts at a position between a mounting section and opening section and electrically connecting the outer and inner lead sections of the widest lead to a conductor layer on the rear surface of a substrate. CONSTITUTION:Numerous leads 20 are formed on a film-like base material 10 and the inner lead section 21 of each lead 20 is concentrated to an electronic parts 40 mounting section formed on the material 10. Then at least one of the leads 20 is made to have the largest width among the leads 20 and divided into tow parts at a position between the mounting section and an opening section 11. At the same time, the outer lead section 22 and inner lead section 21 of the widest lead 20 are electrically connected with a conductor layer formed on the rear surface of the material 10 through through holes 21a and 22a formed through the material 10. Therefore, a power line can be made not to produce a large impedance without exerting any influence on leads constituting signal lines.</p>
申请公布号 JPH03293757(A) 申请公布日期 1991.12.25
申请号 JP19900097325 申请日期 1990.04.11
申请人 IBIDEN CO LTD 发明人 YANAGAWA YOJI;MORI SHIGEKI;YABE SHUICHI;HORIBA YASUHIRO
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
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