| 摘要 |
<p>PURPOSE:To obtain an apparatus which reduces the contamination of a wafer and the possibility of chippings even when an arm comes into contact with the water, by which the yield of semiconductor elements is enhanced and which can transfer the wafer accurately by a method wherein at least the part at which the arm abuts on the wafer is formed of a member including a semiconductor. CONSTITUTION:At a wafer transfer apparatus which holds a wafer 10 on an arm 40 and transfers it, at least the part at which the arm 40 abut on the wafer 10 is formed of a member including a semiconductor. For example, a wafer transfer machine 20 can be moved up and down by means of an elevating mechanism 30 and can be turned horizontally by using a rotary mechanism 32. It is provided with five thin-sheet arms 40 on which a wafer 10 is placed and which can be extended and contracted. Each arm 40 is provided with a recessed part 42 formed in such a way that it accepts the wafer 10 and that its peripheral edge is fitted to it. The thickness of the arm 40 is set at 1.3mm; the depth of the recessed part 42 is set at 0.6mm. The arm is manufactured to a prescribed shape by mechanical working operations of a cutting operation and a polishing operation and by an etching operation in the same manner as when wafers are formed from a cylindrical single-crystal Si block; the surface is mirror-worked.</p> |
