发明名称 MICROCAPSULE, ADHESIVE COMPOSITION USING SAME, AND CURING METHOD THEREFOR
摘要 PURPOSE:To permit foaming of an organic foaming agent with heat, thereby breaking capsules and releasing a curing agent by covering a core material comprising the foaming agent and the curing agent with a hard wall material comprising a thermoplastic resin to form the capsules. CONSTITUTION:A core material (A) is prepared by blending 1 pt.wt. organic foaming agent having a softening point higher than that of the following wall material (e.g. azodicarbonamide), 1-100 pts.wt. curing agent (e.g. 2- undecylimidazole) and, if necessary, auxiliaries, curing accelerator, etc. Then, microcapsules with an average particles size of 100mum or less are provided by covering 1 pt.wt. component A with 0.01-10 pts.wt. wall material comprising a thermoplastic resin having a softening point of 70-200 deg.C (e.g. PS). The above microcapsules are blended with an epoxy, urethane or polysulfide resin to form an adhesive composition.
申请公布号 JPH03292378(A) 申请公布日期 1991.12.24
申请号 JP19900095897 申请日期 1990.04.10
申请人 NITTO DENKO CORP 发明人 URAZUKA ISAO;YAMAMOTO HIROSHI;YAMAMOTO KAZUHIKO;HOSOKAWA TOSHITSUGU
分类号 B01J13/02;C08G59/18;C09D201/00;C09J5/00;C09J11/06;C09J163/00;C09J201/00;C09K3/10 主分类号 B01J13/02
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