发明名称 MANUFACTURE OF RESIN MOLDED ITEM HAVING REDUCED RESIDUAL STRESS
摘要 PURPOSE:To make it possible to reduce residual stress in a short period of time by a method wherein a molded item is heated by high frequency dielectric heating with frequencies, which are available for the resin of the molded item. CONSTITUTION:A molded item is rapidly heated in a high frequency dielectric heating device with frequencies, which are available for the resin of the molded item, up to almost annealing temperature and, held at said temperature. Frequen cies available for heating depends upon the kind of resin and its additive and the like and the optimum frequencies are selected. For example, in the case of a resin molded item, which is singly or mainly made of polycarbonate resin, high frequency dielectric heating, the frequencies of which to be selected lie within the range of 10<8>-10<11>Hz is selected and its heating temperature is set to be publicly known annealing temperature in response to respective resins. Thus, residual stress can be removed in an extremely short period of time. Further, as the result of remarkable shortening of treatment time, the staining of the surface of the molded item with dust, dirt and the like is remarkably settled.
申请公布号 JPH03293118(A) 申请公布日期 1991.12.24
申请号 JP19900094055 申请日期 1990.04.11
申请人 MITSUBISHI GAS CHEM CO INC 发明人 IWAKIRI TOKIAKI;IZUMIDA TOSHIAKI;IWAKI MASANORI;SADANO TSUTOMU
分类号 B29C71/02;B29K69/00;B29L11/00 主分类号 B29C71/02
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