| 摘要 |
<p>PURPOSE:To improve a semiconductor module package in mounting density by a method wherein a semiconductor element is mounted on a first multilayer wiring board, first conductor pads are formed on the peripheral part of the wiring board, chip components are mounted on a second multilayer wiring board mounted with second conductor pads, the conductor pads are joined together, and the first and the second wiring board are hermetically sealed up. CONSTITUTION:A recess 15 is demarcated in a base ceramic multilayered wiring board 14 by a side wall located at the periphery of the board 14, and LSIs 4 are die-bonded to the inner surface of the board 14. The conductor pads of the LSIs 4 and the conductor pads of the ceramic multilayered wiring board 14 are connected together with bonding wires 8. Conductor pads 16 are formed on the top of a side wall 14a. Conductor pads 20 are formed on the periphery of a cap side seramic multilayered wiring board 18 corresponding to the conductor pads 16 of the base side board 14, and chip components 6 are mounted on the wiring board 18. The cap side board 18 is turned upside down and laid on the base side board 14, the correspondent conductor pads are bonded together through solder bumps or a conductive adhesive agent, nitrogen gas is filled into the inside of the overlapped boards 14 and 18, and the joints of the boards 14 and 18 are hermetically sealed lip with a sealing agent 22.</p> |
