| 摘要 |
PURPOSE:To obtain a hybrid device in which a hole is not closed, which can prevent a short circuit and whose reliability is high by a method wherein a bump by which electrodes for functional elements formed on a first plane substrate and a second plane substrate are connected electrically to each other is formed of a thermoplastic conductive resin member. CONSTITUTION:The following are provided: a first plane substrate 1; a plurality of first functional elements 2 formed in the first plane substrate 1 unidimensionally or two-dimensionally; a second plane substrate 6; a plurality of second functional elements 7 formed in positions opposite to said first functional elements 2 unidimensionally or two-dimensionally in the second plane substrate 6; and thermoplastic conductive resin members 4A which electrically connect electrodes of said first and second functional elements 2, 7 and which unite the first and second plane substrates 1, 6. For example, said thermoplastic conductive resin members 4A are formed by uniformly dispersing a metal powder to a thermoplastic resin; a polyethylene resin, a polypropylene resin, a polyethylene terephthalate resin or the like is used as the thermoplastic resin. |
