Composition and coating to prevent current induced electrochemical dendrite formation between conductors on dielectric substrate
摘要
The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.
申请公布号
US5074969(A)
申请公布日期
1991.12.24
申请号
US19910666007
申请日期
1991.03.07
申请人
IBM CORPORATION
发明人
BREWER, WILLIAM D.;GREBE, KURT R.;HORTON, RAYMOND R.;MATTHEW, LINDA C.;NOYAN, ISMAIL C.;PALMER, MICHAEL J.;PURUSHOTHAMAN, SAMPATH;RATH, DAVID L.