| 摘要 |
A method by which leads of a semiconductor component are bent into their final shape using a roll forming process to bend the leads into the desired shape before separation of the individual components. The roll forming process achieves a final form by passing a lead frame holding a plurality of the semiconductor components through a series of form rollers which progressively bend the leads into the final shape. The method can be designed to cut the components free from the lead frame as a final step, minimizing the individual handling of the miniaturized components.
|
