| 摘要 |
PURPOSE:To make a chip carrier nearly equal to an integrated circuit chip in size so as to improve it in mounting density and to prevent a voltage from dropping at the center of the chip by a method wherein the integrated circuit chip is mounted in such a manner that leads are provided to a chip carrier board corresponding to the position of outer electrodes, and the outer leads of an integrated circuit chip are connected to the leads concerned. CONSTITUTION:Through-holes are provided to a silicon board 4, an SiO2 film 5 is formed on the surface of the board including the through-holes through a thermal oxidation method or a CVD method, leads 6 provided with nail heads are inserted into the through-holes from the upside of the chip carrier board, and a metallized layer 55 provided to the surface of the chip carrier substrate adjacent to the lower end of the through-holes is jointed to the leads 6 with brazing materials 54. Then, outer electrodes 2 provided to the primary face of an integrated circuit chip 1 are aligned with the heads of the leads 6 and connected together with solders 3. Then, the inside of a cap 9 is bonded to the rear of the integrated circuit chip 1 through an epoxy resin film 8 which contains silver particles, a metallized layer 7 provided to the lower peripheral edge of the chip carrier board is jointed to the end of the cap 9 through a solder layer 10 to seal up a chip carrier.
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