| 摘要 |
A method for aligning infrared detector arrays having a high density of pixel elements to the surface of a signal processing module or the like is disclosed. The process comprises the steps of forming a plurality of indicia upon the second side of the infrared detector array, forming a corresponding plurality of reference indices upon the support surface, the indices being disposed in a predetermined position relative to the electrical connectors, attaching the second side of the infrared detector array to a transparent substrate and positioning the detector array adjacent the support surface and aligning the indicia to the reference indices by observing the indicia formed upon the second side of the array by looking through the transparent substrate. Three embodiments of indicia are disclosed. A through hole indicia passes from the first surface of the infrared detector array to the second surface thereof, a plurality of fiducial indicia can be formed upon the second surface of the infrared detector array, or notches can be formed in the edges of the infrared detector array and/or substrate.
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