| 摘要 |
PURPOSE:To improve yield deterioration due to shortcircuit in manufacture of a multilayer substrate by punching and cutting off a shortcircuit part together with a green sheet and by returning it to a lamination process after charge. CONSTITUTION:A shortcircuit part of a conductor printed pattern 1 alone is punched and removed together with a green sheet of a substrate. A release film is applied to a lower side of the green sheet to close up a hole 3. Slurry of the same system as green sheet raw material is charged in the hole 3. The slurry is swelled a little on the hole 3 in consideration of volume reduction due to drying. The green sheet is dried and a release film is removed, and it is returned to a manufacture process of a multilayer substrate. Manufacture yield can be improved by this constitution. |
