| 摘要 |
PURPOSE:To prevent damage of a bendable substrate by burying a removed part of a laminated board with buried resin, by flattening a surface of the laminated board without a clearance, by preventing treatment solution from entering, by enabling easy formation of an outer layer, and by fusing and removing the buried resin. CONSTITUTION:An interlaminar bonding sheet 3 whose specified position is punched is laminated on a bendable substrate 1 which is provided with a copper foil pattern on a polyimide film. Then, a copper clad laminated board 2 having a copper foil circuit on one side is punched at the same part as the bonding sheet 3, laminated on the interlaminar bonding sheet 3 with a circuit inside, and formed integrally by applying a pressure. Heat curing type hole-filling ink is charged and an ink film on a surface after cured is removed. After punching, plating and surface circuit formation, ink is fused and removed with specified liquid and a rigid/flexible wiring substrate is acquired. According to this constitution, a highly economical wiring substrate which has a bendable part and does not cause deterioration of characteristics and quality can be acquired. The hole is protected by a mold releasing sheet 5. |
