| 摘要 |
PURPOSE:To prevent generation of disconnection in a viahole by peeling off a required film on a surface of a green sheet whereon a viahole and a conductor pattern are formed and by recognizing and laminating it after leaving it to stand in a specified atmosphere for a specified time. CONSTITUTION:A stabilization film 13 which is applied to a surface of a green sheet 14 whereon a viahole 16 and a conductor pattern 17 are formed is peeled off and left to stand in an atmosphere of humidity of about 60% and temperature of 23 deg. for about 8 hours. Through the process, a green sheet whose size is stabilized is laminated and burnt recognizing a reference mark thereof; then, a ceramic multilayer wiring board which does not produce disconnection in a viahole can be formed since a stabilized green sheet is used. |
