| 摘要 |
PURPOSE:To acquire an LED display element of good humidity resistance and thermal strain resistance by holding an LED chip between two glass substrates, by enclosing it with a spacer, and by sealing it by heating and curing conductive adhesive and sealing agent. CONSTITUTION:An ITO film 2 and an Au film are laminated on a glass substrate 1. Ag paste 3 is applied and an LED chip 4 is mounted. A spacer 5 is put on a periphery of the chip 4. A spacer thickness has accuracy of 0 to -20% to a chip thickness. Epoxy resin 6 is applied to a periphery of the spacer 5 and heat treatment is carried out. Then, another glass substrate 1' having Ag paste 3' on an ITO film 2' is laminated on the glass substrate 1 to hold the chip 4 and the spacer 5 therebetween, and heated at 200 deg.C for about 4 hours. According to this constitution, the LED chip 4 is directly connected to a pair of glass substrates 1, 1' and held, and a sealed LED element is completed. |
