发明名称 METHOD OF WAFER ALIGNMENT
摘要 <p>PURPOSE:To facilitate accurate alignment even if the conveying posture of a wafer is changed by a method wherein the wafer supported by a stopper is temporarily separated from the stopper and, in that state, an orientation flat is detected and the conveying posture is adjusted and then the wafer is received and supported by the stopper again for positioning. CONSTITUTION:When it is detected that a wafer is received and supported by a stopper 14, a table 15 starts an attracting operation and, at the same time, is elevated and turned. When it is detected that one end (a) of the orientation flat OF of the wafer reaches a position X which is on the opposite side to the stopper 14 and on the center line of a conveying route, the table 15 stops turning. Then the wafer is supported by a conveying belt and pressed against the stopper 14 again. After that, both the ends (a) and (b) of the OF are detected for positioning. With this constitution, regardless of the posture of the wafer at the time of carrying-in, the wafer can be positioned with a high accuracy.</p>
申请公布号 JPH03290947(A) 申请公布日期 1991.12.20
申请号 JP19900092801 申请日期 1990.04.06
申请人 NITTO DENKO CORP 发明人 KURODA SHIGEHISA;ITO HIDEO
分类号 H01L21/68 主分类号 H01L21/68
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