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发明名称
METHOD AND APPARATUS FOR DIE-BONDING
摘要
申请公布号
JPH03290935(A)
申请公布日期
1991.12.20
申请号
JP19900092639
申请日期
1990.04.06
申请人
MITSUBISHI ELECTRIC CORP
发明人
KANDA MAKOTO;MITARAI TADASHI;BANJO TOSHINOBU
分类号
H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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