| 摘要 |
<p>PURPOSE:To obtain the subject resin composition having excellent heat- resistance, oxidation resistance at high temperature and decreased thermal stress and useful for the encapsulation of semiconductor by using glycidyl ether of a hydrogenated conjugated diene polymer as an essential component. CONSTITUTION:The objective composition contains, as essential components, (A) glycidyl ether of a hydrogenated conjugated diene polymer, (B) a polybutadiene containing epoxy group in the molecule, (C) an epoxy resin and (D) a reaction product of a phenolic compound and formaldehyde. Preferably, the composition contains a reaction product of the components A, B and C and the component D as essential components, and the component A is a hydrogenated butadiene and/or isoprene (co)polymer preferably containing 1,2-butadiene skeleton.</p> |
