| 摘要 |
PURPOSE:To prevent it from creating the projections of X-ray transmitting material or the surface from having flaws or dust by providing the side of a silicon wafer substrate with a cut. CONSTITUTION:A cut is provided at the side face of a silicon wafer. The cuts to be provided at the side face of this silicon wafer substrate shall be provided at one place or more of the same silicon wafer substrate, and for the shape, any shape will do so long as it is not grounded to the surface of the substrate holder or the silicon wafer when holding the silicon wafer with the substrate holder. |
