发明名称 |
Au-Sn transient liquid bonding in high performance laminates. |
摘要 |
A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, mulilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy. <IMAGE> |
申请公布号 |
EP0461378(A2) |
申请公布日期 |
1991.12.18 |
申请号 |
EP19910106995 |
申请日期 |
1991.04.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAVIS, CHARLES R.;HSIAO, RICHARD;LOOMIS, JAMES R.;PARK, JAE M.;REID, JONATHAN D. |
分类号 |
H01R43/02;B23K35/00;B23K35/30;H01R4/02;H05K3/28;H05K3/32;H05K3/40;H05K3/46 |
主分类号 |
H01R43/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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