发明名称 Wiring connecting device.
摘要 <p>A wiring connecting device (1) for mounting an IC chip (2), comprises a flexible substrate (10) on which are mounted connecting wires (11,12) having connecting portions (C1,C2) for making electrical connections with the IC chip, and an aperture (h1,h2,h3) in the flexible substrate (10) completely over which the connecting portions (C1,C2) extend. <IMAGE></p>
申请公布号 EP0461875(A2) 申请公布日期 1991.12.18
申请号 EP19910305296 申请日期 1991.06.12
申请人 SEIKO EPSON CORPORATION 发明人 KAMIMURA, MASARU
分类号 G02F1/1345;G09F9/00;H01L23/495;H01L23/498;H01R3/00 主分类号 G02F1/1345
代理机构 代理人
主权项
地址