发明名称 POLISHING METHOD FOR CERAMIC SUBSTRATE
摘要 PURPOSE:To make the wear states of the surface plates of both a 1st and 2nd surface grinders in the same degree and to shorten the loss time until a rough finished ceramic substrate is copied to the surface plate of the 2nd surface grinder for precise finishing, by increasing or decreasing the rocking width of one part of the ceramic substrates of the 1st and 2nd both surface grinders. CONSTITUTION:The progress of the wear of the surface plate 1b of a 2nd surface grinder B becomes fast, when the rocking width of the ceramic substrate W of the 2nd surface grinder B is increased, and the progress of the wear of the surface plate 1b of the 2nd surface grinder B becomes slow, when the rocking width of the ceramic substrate W of the 2nd surface grinder B is decreased. So, the flatness alphaa of the surface plate 1a of a 1st surface grinder A and the flatness alphab of the surface plate 1b of the 2nd surface grinder B can be made coincident, by comparing the flatness alphaa of the surface plate 1a of the 1st surface grinder A and the flatness alphab of the surface plate 1b of the 2nd surface grinder B with their measurements and increasing and decreasing the rocking width of the ceramic board W of the 2nd surface grinder B, at all times.
申请公布号 JPH03287369(A) 申请公布日期 1991.12.18
申请号 JP19900086817 申请日期 1990.03.30
申请人 FUJITSU LTD 发明人 HOSOYA TADAO
分类号 B24B37/00;B24B37/07;B24B37/10;B24B53/017 主分类号 B24B37/00
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