| 摘要 |
<p>PURPOSE:To contrive to improve the moisture resistance and high temperature electrical characteristics by using epoxy resin, phenol aralkyl resin, and a sealer containing organic phosphine compound as the main material. CONSTITUTION:As the resin sealer for a semiconductor device, the epoxy resin, the phenol aralkyl resin, and the material containing organic phosphine compound are used. The epoxy resin is usually known and not particularly restricted. The phenol aralkyl resin is used as a hardener for the epoxy resin. The organic phosphine compound is used as a hardening promotor, and the moisture resistance or high temperature electrical characteristics can be improved by using it.</p> |
