| 摘要 |
PURPOSE:To improve electrical connection properties of a via and to improve reliability of a multilayer ceramic substrate by forming a land for filling a via hole of a green sheet after peeling off a mask film. CONSTITUTION:After a via hole 3 is shaped in a green sheet 1 whereon a mask film 2 is arranged through boring process, the via hole 3 is filled with a conductor 4. When a plurality of green sheets 1 are laminated and burnt after the mask film 2 is peeled off, a land 8 is formed for filling the via hole 3 while conducting with the conductor 4. As a result, even when a part of the conductor 4 is removed by peeling of the mask film 2 and a clealance part is formed, the land 8 functions to fill the clearance part; therefore, it is possible to improve reliability of electrical connection of the via. |
