| 摘要 |
PURPOSE:To increase the degree of freedom of disposing pads in a chip, further to stabilize a wire loop and reduce a chip size by so bending parts of leads covered with resin molded forms as to cross with a plurality of other leads. CONSTITUTION:A tab 5 is supported by a tab hanging lead 6 a plurality of inner leads 2 and bent leads 1 crossing the leads 2 are provided around the tab, and a lead frame is formed including outer leads. The frame is entirely bent in a plane state in an initial state, the leads 1 are so disposed at a position opposed to the tab as indicated by broken lines 1', so bent from the midway as to be folded upward, and formed in a direction crossing above the leads 2. A semiconductor chip 4 is bonded on the tab 5, and the electrode pads around the chip 4 are connected to the leads 2, the lead 2 via gold wires 3. The chip, the tab and the inner leads are sealed with a resin molded form 8. |
