发明名称 MOUNTING METHOD FOR LEAD OF ELECTRONIC PART WITH LEAD, AND PUSHER FOR MOUNTING LEAD
摘要 PURPOSE:To prevent the generation of a microcracks, etc., without damaging an element-assembly fitting section, to improve reliability and to reduce manufacturing cost by pushing an inserting hole by a pusher and deforming the inserting hole in a deviated circular shape when an electronic-part element assembly is fitted to be into the inserting hole of a lead cap. CONSTITUTION:A first pusher 28a and a second pusher 28b pushes a lead cap 24 until the first pusher 28a and the second pusher 28b are abutted in the directions of Ya and Yb. When the first pusher 28a and the second pusher 28b are abutted, a pushing hole 31 using a first pushing side 30a and a second pushing side 30b as one sides is formed, the lead cap 24 is elastically deformed in the direction Z by said pushing hole 31, and the inserting hole 25 of the lead cap 24 is elastically deformed in a deviated circular shape. An air gap S is formed to the inwall 24a of the cap to the diagonal length of an electronic- part element assembly 22 by such elastic deformation. Accordingly, inserting pressure for fitting and holding an element-assembly fitting section 22a onto the inwall 24a of the cap can be removed.
申请公布号 JPH03284823(A) 申请公布日期 1991.12.16
申请号 JP19900086793 申请日期 1990.03.30
申请人 TAIYO YUDEN CO LTD 发明人 OKADA HIROSHI;WATANUKI YOSHIO
分类号 H01G4/228;H01G4/248;H01G13/00 主分类号 H01G4/228
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