发明名称 MOLDING DIE FOR LAY-FLAT FILM
摘要 <p>PURPOSE:To make the exchange between a die for two-resin threelayered film and a die for two-resin two-layered film without accompanying risk and costing too much cost of equipment, time and labor by a method wherein respective openings of connecting paths of resin flow paths, which communicate with each other in a resin flow path conversion block, and blocking plugs for blocking the openings are arranged concyclicly at specified angular intervals, on the mounting plane to a feed block. CONSTITUTION:When X resin is fed through an X resin feed opening 10, the X resin is sent to inner layer resin flow paths n2 and n1 and to outer layer resin flow paths g2 and g1 so as to form the inner and outer layers of film. When Y resin is fed through a Y resin feed opening 11, the Y resin is sent to intermediate layer resin flow paths t2 and t1 so as to form the intermediate layer of the film, resulting in obtaining two-resin three-layered film. Under the condition that a resin flow path conversion block 1 is turned by 120 deg. to one direction or to the opposite direction and, after that, mounted to a feed block 2 with bolts 14, when the X resin is fed through the X resin feed opening 10, the X resin is sent to the outer layer resin flow paths g2 and g1 so as to form the outer layer of film. When the Y resin is fed through the Y resin feed opening 11, the Y resin is sent to the inner layer resin flow paths n2 and n1 and to the intermediate layer resin flow paths t2 and t1 so as to form the inner layer and the intermediate layer of the film, resulting in obtaining two-resin two-layered film.</p>
申请公布号 JPH03284924(A) 申请公布日期 1991.12.16
申请号 JP19900084899 申请日期 1990.04.02
申请人 MITSUBISHI PETROCHEM CO LTD 发明人 HIROSE HIDENORI;KUSAKAWA WATARU
分类号 B29C47/26;B29C55/28;B29L9/00 主分类号 B29C47/26
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