发明名称 AIRTIGHTLY SEALED MODULE
摘要 <p>PURPOSE:To simplify manufacture of the title module and thereby to improve economics by a method wherein transistor(TR) blocks having semiconductor pelletes mounted thereon respectively are shaped in required pentagons, disposed in a prescribed manner and sealed airtightly. CONSTITUTION:TR blocks 106A to 106F having semiconductor pellets 108A to 108F mounted thereon are shaped in pentagons each having three right angles and are disposed inside a round cap 100 so that the side of each of them positioned between two angles not being right is opposite to the inner wall of the cap 100, and they are sealed airtightly. thus constitution enables employment of the TR blocks in the same shape and thus an airtightly sealed module being easy to prepare and having hight economics is obtained.</p>
申请公布号 JPH03283650(A) 申请公布日期 1991.12.13
申请号 JP19900084649 申请日期 1990.03.30
申请人 TOSHIBA CORP 发明人 MOCHIDA HISASHI;TAKEDA KAZUYOSHI
分类号 H01L25/18;H01L21/52;H01L23/04;H01L25/04;H01L25/16 主分类号 H01L25/18
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