| 摘要 |
PURPOSE:To connect conductor patterns of resin board group to that of a thermally deformable resin board by connecting first, second conductor patterns disposed at the same side through conductor paste of thermally deformable resin binder by a hot press. CONSTITUTION:A first conductor pattern surface of a first film 11 made of thermally deformable resin is disposed in the same plane as a second conductor pattern surface of a thermally deformable resin board 17, and both the patterns 15, 17 are electrically connected by conductor paste 18 with thermally deformable resin as binder. A multilayer resin board 19 is manufactured by heating, pressurizing and press-bonding integrally in this disposed state. The board 17 formed with a second conductor pattern 16 on its surface is so formed on a resin body 14 that the pattern surfaces are disposed at the same surface side, the pattern 15 of the film 11 and the pattern 17 of the board 17 can be visually observed from above, easily aligned by using the paste 18 of the first, second patterns to be electrically connected. |
