| 摘要 |
PURPOSE:To improve green sheets in adhesion between them so as to enhance a multilayer ceramic circuit board in number of layers by a method wherein solvent is applied onto the surfaces of the green sheets which contain ceramic powder and resin, and the green sheets are laminated. CONSTITUTION:Solvent is sprayed onto the surface of a green sheet which contains ceramic powder and resin to make resin chemically flexible so as to fuse it into one with other resin contained in other green sheets, and the green sheets are laminated and thermocompressed so as to come into close contact with each other. Or, the surface of a green sheet is made to contain more binder and plasticizer so as to enable green sheets to be easily bonded together. By this setup, as green sheets are enhanced in adhesion at laminating, a green sheet laminate of integral structure can be obtained even if it is increased in number of layers. |
