| 摘要 |
<p>PURPOSE:To prevent the direct transfer of solder heat in soldering an electronic component body and to relieve stress applied to electronic components from inside and outside by forming one electrode at a region except the area which faces the electronic component on a board. CONSTITUTION:A mounting electrode 21a for collector terminal 12 is formed at a near region except the area which faces the bottom 11c of a main body 11. This allows neither creeps of solder between the body's bottom 11c and a board 20 in soldering nor deposits of solder on the body's bottom 11c and prevents the tight connection of the body 11 to the board 20. This can prevent resin RN that fills the body 11 from being thermally activated and relieve stress evolved after resin-coating from resin shrinkage and applied from the board 20, etc., to the body 11. This is accompanied by prevention of cracks CR in a transistor chip 15 and is advantageous in improving the productivity and reliability of hybrid ICs.</p> |
